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Silicon Photonics Packaging Technical Leader- (Hybrid)

Cisco · Carlsbad, California, United States

Hybrid Full-time Posted 5 days ago

About this role

The application window is expected to close on: 06/30/2026<p><span style="color:#000000"><b><span style="font-size:14px">Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received</span></b><span style="font-size:14px">.</span></span></p><p></p><p>This is a hybrid role with two days per week at Cisco’s Carlsbad or Allentown office.</p><h2></h2><p></p><h2><b>Meet the Team</b> </h2><p>The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco’s core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms—like Silicon One—are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow

Because full product development—from design to qualification to production—is within our team, we’re able to think differently, experiment more, and work quickly. Join us to power the future of the digital world.</p><p></p><h2><b>Your Impact</b></h2><p>As a Packaging Technical Leader, you will be responsible for the development and qualification of advanced packaging solutions for Cisco’s next generation optical transceiver products.</p><ul><li><p>Serve as the primary technical interface for the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT) driving advanced package assembly, test, and qualification for silicon photonics products.</p></li><li><p>Lead the design and layout of test vehicles to validate packaging processes; conduct rigorous design reviews for complex substrates, ensuring alignment with signal/power integrity requirements and manufacturing capabilities.</p></li><li><p>Cross-functional technical leadership to proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the s

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