Thermal Compression Bonding Development Engineer

About this role

Job Details: Job Description: The Role and Impact: Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) department, where you'll play a pivotal role in shaping the future of assembly and packaging technologies. In this position, you will drive innovation and optimization in Thermal Compression Bonding process for Intel's advanced packaging roadmap, contributing directly to the quality, reliability, and manufacturability of cutting-edge semiconductor packages. With an emphasis on experimentation, data analysis, and collaboration, you'll support Intel's mission to deliver world-class products that empower global innovation

This role provides an opportunity to make a meaningful impact on Intel's success and growth in the semiconductor industry. Key Responsibilities: Develop and optimize assembly processes and equipment to enable Intel's next-generation packaging technologies. Apply statistical methods and principles of design of experiments (DOE) to establish and improve process specifications

Analyze process data to identify opportunities for improving quality, yield, productivity, and cost efficiency. Collaborate with cross-functional teams to ensure manufacturability and reliability of package designs. Document technical advancements and improvements through white papers and reports

Qualifications: Minimum Qualifications: Possess a Master's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Electronic Engineering, Chemical Engineering, Physics, or a related STEM field. Familiarity with semiconductor assembly equipment and processes. Preferred Qualifications: PhD degree holders, or Master’s degree holders with less than 2 years of experience in Thermal Compression Bonding process, with First Class Honours required

Experience with data science tools such as Python, SQL, or JMP. Proficiency in statistical methods, i

Apply for this role on Intel’s official careers site.