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Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE)

Micron Technology · Hyderabad - Phoenix Aquila, India

Engineering Engineering: General & Specialist Full-time Posted 4 days ago

About this role

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you ready to be part of a world-class team driving innovation at the intersection of silicon development and advanced packaging? We are seeking an exceptionally skilled and ambitious Sr Engineer for our Advanced Packaging Build Enablement Engineering (APDEE) team, located in Hyderabad, Telangana, India

This role is pivotal in accomplishing a flawless build strategy for High Bandwidth Memory (HBM) packaging programs. Advanced Packaging Technology Development org is seeking an experienced and technically strong Semiconductor design Senior Engineer to support High Bandwidth Memory (HBM) packaging program. This role sits at the critical intersection of silicon design and advanced packaging, responsible for executing advanced packaging related design strategy that enables world-class HBM product integration

In this position, you will collaborate with Micron’s various design teams HIG DTPCO, DRAM designers all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction Key Responsibilities • Build and tapeout PWF Reticles Design • Developing DFTs in test vehicles for packaging related fail modes • Coordinate with HIG-HBM DTPCO and HIG-HBM teams to build test structures for live die • Design rules management, Process Design rules for PWF , wafer thinning and dicing, die stacking etc • BEOL Design - mainly engagement with FE Integration teams • Engage with Scribe Design team to capture Advanced Packaging requirements and Review • TSV desi

Apply for this role on Micron Technology’s official careers site.

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