Principal Engineer Advanced Package Technology Development
Micron Technology · Boise, ID - Main Site, United States
Full-time Posted 4 days ago
About this role
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job summary As a Principal Engineer within Micron’s Advanced Package Technology Development team, you will play a key role in driving innovation through strategic, industry‑informed leadership
Based at the Boise campus, you will shape advanced packaging technology roadmaps and investment priorities by applying deep technical expertise alongside rigorous cost and value analysis, enabling well‑balanced trade‑off decisions across performance, scalability, and total cost of ownership. Working in a highly collaborative, dynamic environment, you will influence solutions aligned with Micron’s business objectives, contributing directly to increased revenue, long‑term strategic success, and the development of leading‑edge packaging technologies. Responsibilities Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value
Collaborate continuously with internal and external partners to ensure seamless technology integration. Consult and influence technical and strategic decisions at senior management levels. Analyze and understand competitive trends to improve Micron’s competitive edge
Guide the development of packaging technology roadmaps. Assess competitive metrics through data intelligence for strategic advantage. Define requirements with proven technical data and content.
Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements. Minimum Qualifications Over 5 years of professional experience in semiconductor advanced packaging. BS, MS, or Ph.D
in Material Science, Electrical, Chemical, Mechanical Engineering, Physi
Apply for this role on Micron Technology’s official careers site.