Intern - Assembly Equipment Engineer
Micron Technology · Penang, Malaysia - Grande, Malaysia
About this role
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Project Title: Improvement of NSOP (Non‑Stick On Pad) Alarm for WB Process Early Detection Description: Enhance NSOP (Non‑Stick On Pad) detection and alarm capability in the Wire Bond (WB) process to enable early identification of bond stick failure, reduce unscheduled downtime, and prevent extended production impact due to delayed NSOP response
Scope: Define and standardize NSOP (Non‑Stick On Pad) failure criteria in WB process Improve NSOP alarm logic for early detection before mass failure occurs Collaborate with EE and Manufacturing Engineers to align alarm thresholds with actual bonding behavior Execute UAT and pilot run on selected WB machines after alarm enhancement Collect NSOP event data for downtime, frequency, and failure trend analysis Supporting Team: Equipment Engineering (EE) Team Manufacturing Engineering Team Process Engineering Team Automation / System Team (if alarm data integration is required) Deliverables: Clearly defined NSOP (Non‑Stick On Pad) detection criteria for WB process Improved or new NSOP alarm with early warning capability Reduction in unscheduled downtime caused by delayed NSOP detection NSOP alarm data available for equipment and process improvement analysis Stretch Goal: Correlate NSOP alarms with bond parameters (US power, force, time, pad condition) Implement trend‑based or predictive warning before repeated NSOP occurs Reduce false alarm rate while maintaining high sensitivity for true NSOP events Requirement: Electrical / Equipment Engineering (EE) Manufacturing Engineering Semiconductor / Mechanical / Mechatronics Engineering About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions tran
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