Engineer (Wafer Probing)

About this role

## Company: RF360 Singapore Pte., Ltd. ## Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Scope * Lead wafer probing and failure analysis team in achieving product yield, output and cost effectiveness. * Maintain effective, accurate and robust measurement procedures in wafer probing

* Ensure smooth process flow with high quality, high yield, low cost by working with cross functional teams to achieve the overall committed targets. * Support new technology and qualification setup. Job Responsibilities * Perform comprehensive wafer probing and failure analysis and report failure analyses timely

* Work with process technician and yield engineers on effective hold lots dispositions. * Ensure wafer prober measurement integrity and prober matching across all wafer probers. * Analyze and reduce NTF to improve wafer prober measurement integrity

* Design and set up proper probe cards/cores maintenance and management. * Contribute in quality investigations and continuous improvement programs to resolve chronic process and quality issues, and institute permanent resolutions to assure product quality and enhance process robustness. * Proactively drive team deployment and apply hands-on and with deep involvement at work

* Regular reviews of OCAP, FMEA and Control Plans. * Ensure timely update of procedures and effective implementations. * Coach and guide process technicians in process, failure and yield analyses and product to build up their technical competencies * Take accountability of work and possesses strong sense of responsibility Education/Experience Requirements * At least a Bachelor’s degree in Electronic or Electrical Engineering or Material Science or equivalent

* Fresh graduates who like hands on activities or Engineers with 1-2 years of working experience. * Direct working experience in wafer fab process integration will be added advantage. * Possess strong techni

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