Engineer, Thermal Mechanical Simulation
Micron Technology · Hyderabad - Phoenix Aquila, India
About this role
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Thermal Mechanical Simulation Engineer you will be responsible for developing new and derivative process and product-level advanced HBM technologies driving Micron’s advantage by designing premier packages in the Advanced Packaging Technology and Development team
In this position, the engineer will be influencing Thermo-mechanical, thermal and fluid designs, finding efficient package structure and materials to mitigate any potential issues. The scope of the engineer’s work is to address all Thermo-mechanical, thermal and fluidic aspects of 2.5D and 3D advanced packaging development that is associated with design, material and process interactions. This position will collaborate with package architecture, fab/package assembly process integration and BU teams
Devices like HBM, advanced packaging, DDR RDIMM/LRDIMM modules, graphics packages, and other Micron architectures need thorough engineering analysis and invention to meet future mechanical requirements. Finite element analysis of package designs enables innovation and the development of outstanding solutions to help further our goals. Utilization of data science techniques and the application to our industry will make Micron more impactful and relevant
Key aspects of this role will be to Innovate, Influence, Collaborate, Partner and Implement. Responsibilities will include, but are not limited to: Support Advance Packaging development Team - Bonding & Packaging Design Maintain knowledge in semiconductor and general electronics packaging technologies such as High Bandwidth Memory (HBM), wafer-to-wafer bonding, Chip-On-Board (COB), Flip Chip, Through Silicon Vias (TSV), etc Detailed understanding of thermo comp
Apply for this role on Micron Technology’s official careers site.