Advanced Package Technology Engineer

About this role

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If you already have a Candidate Account, please Sign-In before you apply. Job Description: As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements. •2.5D & 3D is cutting edge package technology with BRCM’s needs pushing the technology limits

Job Scope (Advanced Package Technology Engineer) –Provide deeper expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution. –Lead in identification, development & qualification; program management with external assembly partners –Lead in memory supplier(s) engagement to define technology and quality requirements. –Interface with other technical teams (DI, Pkg Design, Test Dev) etc

as part of Cross Functional Team. –Support new design wins, NPI and volume ramps. –Develop alternate sourcing & qualification

Basic: Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 3+ years of relevant experience Specific: 4~6 years Hands On experience in 2.5D / 3D Development; In-depth Know-how of Advanced Silicon fab, Bump, Interpose

Apply for this role on Broadcom’s official careers site.